POLYIMIDE RESIN, RESIN COMPOSITION USING SAME, AND LAMINATED FILM

摘要

Provided are: a polyimide resin which has high heat resistance and is capable of uniformly performing temporary adhesion over a large area with no void or the like; a resin composition using the same; and a laminated film. The polyimide resin of the present invention has at least an acid anhydride residue and a diamine residue and contains a residue of a polysiloxane diamine in an amount of not less than 60% by mole in the total amount of the diamine residue.