发明名称 |
WAFER PROCESSING TEMPORARY BONDING ARRANGEMENT, WAFER PROCESSING LAMINATE, AND THIN WAFER MANUFACTURING METHOD |
摘要 |
A temporary bonding arrangement for wafer processing is provided comprising a first temporary bond layer (A) of thermoplastic resin, a second temporary bond layer (B) of thermosetting siloxane polymer, and a third temporary bond layer (C) of thermosetting polymer. Layer (B) is cured with a curing catalyst contained in layer (A) which is laid contiguous to layer (B). An adhesive layer of uniform thickness is formed without insufficient step coverage and other failures. |
申请公布号 |
EP3112434(A1) |
申请公布日期 |
2017.01.04 |
申请号 |
EP20160173969 |
申请日期 |
2016.06.10 |
申请人 |
Shin-Etsu Chemical Co., Ltd. |
发明人 |
TANABE, Masahito;SUGO, Michihiro;YASUDA, Hiroyuki |
分类号 |
C09J183/04;H01L21/302;H01L21/683 |
主分类号 |
C09J183/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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