发明名称 Semiconductor device and method of fabricating the same
摘要 A method of fabricating a semiconductor device includes forming an insulation pattern including a mask region and an open region on a gallium nitride substrate, growing gallium nitride semiconductor layers to cover the insulation pattern, and patterning the semiconductor layers to form a plurality of semiconductor stacks separated from each other, the plurality of semiconductor stacks being electrically isolated from the gallium nitride substrate by the insulation pattern.
申请公布号 US9537045(B2) 申请公布日期 2017.01.03
申请号 US201514796421 申请日期 2015.07.10
申请人 Seoul Viosys Co., Ltd. 发明人 Heo Jeong Hun;Yoon Yeo Jin;Choi Joo Won;Lee Joon Hee;Kim Chang Yeon;Lee Su Young
分类号 H01L29/20;H01L33/00;H01L27/15;H01L33/62 主分类号 H01L29/20
代理机构 H.C. Park & Associates, PLC 代理人 H.C. Park & Associates, PLC
主权项 1. A method of fabricating a semiconductor device, the method comprising: forming an insulation pattern comprising a mask region and an open region on a gallium nitride substrate; growing gallium nitride semiconductor layers from the open region exposing the gallium nitride substrate to cover the insulation pattern by epitaxial lateral overgrowth (ELOG); and patterning the semiconductor layers to form a plurality of semiconductor stacks separated from each other, the plurality of semiconductor stacks being electrically isolated from the gallium nitride substrate by the insulation pattern.
地址 Ansan-si KR