发明名称 |
Semiconductor device and method of fabricating the same |
摘要 |
A method of fabricating a semiconductor device includes forming an insulation pattern including a mask region and an open region on a gallium nitride substrate, growing gallium nitride semiconductor layers to cover the insulation pattern, and patterning the semiconductor layers to form a plurality of semiconductor stacks separated from each other, the plurality of semiconductor stacks being electrically isolated from the gallium nitride substrate by the insulation pattern. |
申请公布号 |
US9537045(B2) |
申请公布日期 |
2017.01.03 |
申请号 |
US201514796421 |
申请日期 |
2015.07.10 |
申请人 |
Seoul Viosys Co., Ltd. |
发明人 |
Heo Jeong Hun;Yoon Yeo Jin;Choi Joo Won;Lee Joon Hee;Kim Chang Yeon;Lee Su Young |
分类号 |
H01L29/20;H01L33/00;H01L27/15;H01L33/62 |
主分类号 |
H01L29/20 |
代理机构 |
H.C. Park & Associates, PLC |
代理人 |
H.C. Park & Associates, PLC |
主权项 |
1. A method of fabricating a semiconductor device, the method comprising:
forming an insulation pattern comprising a mask region and an open region on a gallium nitride substrate; growing gallium nitride semiconductor layers from the open region exposing the gallium nitride substrate to cover the insulation pattern by epitaxial lateral overgrowth (ELOG); and patterning the semiconductor layers to form a plurality of semiconductor stacks separated from each other, the plurality of semiconductor stacks being electrically isolated from the gallium nitride substrate by the insulation pattern. |
地址 |
Ansan-si KR |