| 发明名称 | Method and apparatus for thermal mapping and thermal process control | ||
| 摘要 | A thermal processing apparatus is provided in accordance with some embodiments. The thermal processing apparatus includes a heating source for transmitting incident radiation to a work piece having a circuit pattern formed on a front surface; a radiation sensor configured to receive light radiated from the front surface of the work piece; and a controller coupled to the radiation sensor, the controller being designed to control the heating source to reduce temperature variation of the work piece. | ||
| 申请公布号 | US9536762(B2) | 申请公布日期 | 2017.01.03 |
| 申请号 | US201414539844 | 申请日期 | 2014.11.12 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Tsai Chun Hsiung;Chen Kei-Wei |
| 分类号 | H05B1/02;H01L21/67;H05B3/00;G01J5/00;H01L27/146 | 主分类号 | H05B1/02 |
| 代理机构 | Haynes and Boone, LLP | 代理人 | Haynes and Boone, LLP |
| 主权项 | 1. A thermal processing apparatus, comprising: a heating source for transmitting incident radiation to a work piece having a circuit pattern formed on a front surface of the work piece; a radiation sensor configured to receive light radiated from the front surface of the work piece, wherein the radiation sensor is disposed at a level between the front surface of the work piece and the heating source; and a controller coupled to the radiation sensor, the controller being designed to control the heating source to reduce temperature variation of the work piece. | ||
| 地址 | Hsin-Chu TW | ||