Printed wiring board and method for manufacturing the same

摘要

A printed wiring board includes an insulating layer, a first conductor layer embedded into a first surface of the insulating layer and including connecting portions to connect an electronic component, a second conductor layer projecting from a second surface of the insulating layer, a solder resist layer covering the first conductor layer and having an opening structure exposing the connecting portions, a barrier metal layer formed on the connecting portions such that the barrier layer is projecting from the first surface of the insulating layer, and metal posts formed on the barrier layer such that the metal posts are positioned on the connecting portions, respectively. Each metal post has width which is greater than width of a respective connecting portion, and the barrier metal layer includes a metal material which is different from a metal material forming the metal posts and a metal material forming the first conductor layer.

主权项

1. A printed wiring board, comprising:
a resin insulating layer; a first conductor layer embedded into a first surface of the resin insulating layer and comprising a plurality of connecting portions positioned to connect an electronic component; a second conductor layer projecting from a second surface of the resin insulating layer on an opposite side of the resin insulating layer with respect to the first surface; a solder resist layer formed on the first surface of the resin insulating layer such that the solder resist layer is covering the first conductor layer and has an opening structure exposing the plurality of connecting portions of the first conductor layer; a barrier metal layer formed on the plurality of connecting portions of the first conductor layer such that the barrier metal layer is projecting from the first surface of the resin insulating layer; and a plurality of metal posts formed on the barrier metal layer such that the plurality of metal posts is positioned on the plurality of connecting portions of the first conductor layer, respectively, wherein the plurality of metal posts is formed such that each of the metal posts has a width which is greater than a width of a respective one of the connecting portions, and the barrier metal layer comprises a metal material which is different from a metal material forming the metal posts and a metal material forming the first conductor layer.