Optoelectronic component with a wireless contacting

摘要

An optoelectronic component contains a semiconductor chip (1) and a carrier body (10), which are provided with a transparent, electrically insulating encapsulation layer (3), the encapsulation layer (3) having two cutouts (11, 12) for uncovering a contact area (6) and a connection region (8) of the carrier body, and an electrically conductive layer (14) being led from the contact area (6) over a partial region of the encapsulation layer (3) to the electrical connection region (8) of the carrier body (10) in order to electrically connect the contact area (6) and the electrical connection region (8) to one another. The radiation emitted in a main radiation direction (13) by the semiconductor chip (1) is coupled out through the encapsulation layer (3), which advantageously contains luminescence conversion substances for the wavelength conversion of the emitted radiation.

主权项

1. An optoelectronic component which emits radiation in a main radiation direction, comprising:
a semiconductor chip having a first main area, a first contact area, and a second main area, opposite the first main area, with a second contact area; a carrier body having first and second electrical connection regions insulated from one another, the semiconductor chip being fixed by the first main area on the carrier body and the first contact area being electrically conductively connected to the first connection region; a transparent, electrically insulating encapsulation layer formed on the semiconductor chip and the carrier body, wherein the radiation emitted in the main radiation direction is coupled out through the encapsulation layer, and wherein the encapsulation layer is a glass layer; and a contact connection formed by an electrically conductive layer extending from the second contact area over a region of the encapsulation layer to the second electrical connection region of the carrier body, and electrically conductively connecting the second contact area to the second connection region; wherein an insulating cover layer is applied to the electrically conductive layer; and wherein the cover layer is a glass layer.