High frequency probe card for probing photoelectric device

摘要

A high frequency probe card for probing a photoelectric device includes a substrate having a first opening and at least one first through hole, an interposing plate disposed on the substrate and having a second opening and at least one second through hole, a circuit board disposed on the interposing plate and having a third opening and at least one third through hole, and a probe module mounted to the substrate and having at least one ground probe and at least one high-frequency impedance matching probe having a signal transmitting structure and a grounding structure passing through the at least one first, second and third through holes and being electrically connected with a signal pad and a ground pad of the circuit board, respectively. The first, second and third openings are communicated with each other for light transmission.

主权项

1. A high frequency probe card for probing a photoelectric device, the high frequency probe card comprising:
a substrate having a first opening for light transmission, and at least one first through hole; an interposing plate disposed on the substrate and provided with a second opening communicated with the first opening for light transmission, and at least one second through hole communicated with the at least one first through hole; a circuit board having a top surface, a bottom surface disposed on the interposing plate, at least one ground pad and at least one signal pad arranged on the top surface, a third opening penetrating through the top and bottom surfaces and being communicated with the second opening for light transmission, and at least one third through hole penetrating through the top and bottom surfaces and being communicated with the at least one second through hole; and a probe module mounted to the substrate and provided with at least one ground probe and at least one high-frequency impedance matching probe having a signal transmitting structure and a grounding structure, the signal transmitting structure and the grounding structure passing through the at least one first, second and third through holes and being electrically connected with the signal pad and the ground pad of the circuit board, respectively, wherein the probe module comprises a conductor, the signal transmitting structure is insulated from the conductor by an insulated member, and the grounding structure and the at least one ground probe are electrically connected together by the conductor.