发明名称 |
Methods for producing an at least partially cured layer |
摘要 |
Methods for producing an at least partially cured layer by applying a layer including a (meth)acrylate-functional siloxane to a surface of a substrate, and irradiating the layer in a substantially inert atmosphere with a short wavelength polychromatic ultraviolet light source having a peak intensity at a wavelength of from about 160 nanometers to about 240 nanometers to at least partially cure the layer. Optionally, the layer is at a curing temperature greater than 25° C. In some embodiments, the layer has a thickness of about 0.1 micrometers to about 1 micrometer. In certain embodiments, the layer is substantially free of a photoinitiator and/or an organic solvent. In some particular embodiments, irradiating the layer with a short wavelength polychromatic ultraviolet light source takes place in an inert atmosphere including no greater than 50 ppm oxygen. The substantially cured layer may be a release layer or a low adhesion backsize (LAB). |
申请公布号 |
US9534133(B2) |
申请公布日期 |
2017.01.03 |
申请号 |
US201514955151 |
申请日期 |
2015.12.01 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
Wright Robin E.;Mitera Margaux B.;Walter Richard L.;Seth Jayshree;Venne Janet A. |
分类号 |
C08F2/46;C08F2/50;C09D133/14;C09J7/02;B05D3/06;C09D183/06;D21H19/10;D21H25/08;B05D5/08;C08G77/20 |
主分类号 |
C08F2/46 |
代理机构 |
|
代理人 |
Baker James A. |
主权项 |
1. A method for producing an at least partially cured layer, comprising:
applying a layer comprising a (meth)acrylate-functional siloxane and at least one non-functional polysiloxane material to a major surface of a substrate, wherein the layer is substantially free of added catalysts; and irradiating said layer, in a substantially inert atmosphere comprising no greater than 500 ppm oxygen, with a short wavelength polychromatic ultraviolet light source having at least one peak intensity at a wavelength of from about 160 nanometers to about 240 nanometers to at least partially cure the layer, optionally wherein the layer is at a curing temperature greater than 25° C. |
地址 |
St. Paul MN US |