Sensor module and semiconductor chip

摘要

A sensor module and semiconductor chip. One embodiment provides a carrier. A semiconductor chip includes a first recess and a second recess and a main surface of the semiconductor chip. The semiconductor chip is mounted to the carrier such that the first recess forms a first cavity with the carrier and the second recess forms a second cavity with the carrier. The first cavity is in fluid connection with the second cavity.

主权项

1. A sensor module, comprising:
a carrier; and a semiconductor chip comprising a first recess and a second recess in a main surface of the semiconductor chip, a membrane defined by the first recess, and a back wall defined by the second recess, the back wall being more rigid than the membrane, wherein the side walls of the first recess and the second recess correspond to crystallographic planes of the semiconductor.