| 发明名称 | Imprint lithography | ||
| 摘要 | A method of determining a position of an imprint template in an imprint lithography apparatus. In an embodiment, the method includes illuminating an area of the imprint template in which an alignment mark is expected to be found by scanning an alignment radiation beam over that area, detecting an intensity of radiation reflected or transmitted from the area, and identifying the alignment mark via analysis of the detected intensity. | ||
| 申请公布号 | US9535322(B2) | 申请公布日期 | 2017.01.03 |
| 申请号 | US201113579544 | 申请日期 | 2011.01.11 |
| 申请人 | ASML NETHERLANDS B.V. | 发明人 | Den Boef Arie Jeffrey;Jeunink Andre Bernardus;Wuister Sander Frederik;Kruijt-Stegeman Yvonne Wendela |
| 分类号 | B29C59/02;G01B15/00;G03F7/00;B82Y10/00;B82Y40/00 | 主分类号 | B29C59/02 |
| 代理机构 | Pillsbury Winthrop Shaw Pittman LLP | 代理人 | Pillsbury Winthrop Shaw Pittman LLP |
| 主权项 | 1. A method of determining a position of an imprint template held by an imprint template holder in an imprint lithography apparatus, the imprint lithography apparatus comprising a hardware processor and a non-transitory computer-readable medium containing one or more machine-readable instructions and the method comprising: causing, by the one or more machine-readable instructions when executed by the hardware processor, relative movement between the imprint template and an alignment radiation beam as it is provided from an alignment beam outlet of the imprint lithography apparatus so as to illuminate a first area of the imprint template in which an alignment mark is expected to be found and illuminate a second area of the imprint template not having any alignment feature of the alignment mark within a cross-section of the alignment radiation beam as impinged on the second area; identifying, by the one or more machine-readable instructions when executed by the hardware processor, a position of the alignment mark via analysis of the intensity detected by a detector of the imprint lithography apparatus of radiation reflected or transmitted from the first and second areas; and after determination of the position of the alignment mark, both causing, by the one or more machine-readable instructions when executed by the hardware processor, use of the position to provide the alignment mark in a path of the alignment radiation beam and causing, by the one or more machine-readable instructions when executed by the hardware processor, measurement of alignment with the alignment radiation beam using the alignment mark and a corresponding substrate alignment mark. | ||
| 地址 | Veldhoven NL | ||