摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a flexible printed wiring board exhibiting excellent adhesion of an insulation film and a copper foil after a gold plating step.SOLUTION: A method of manufacturing a flexible printed wiring board where an insulation film is laminated on a copper foil includes a gold plating step and a heat treatment step following the gold plating step. The breaking strength (E) before the gold plating step of the insulation film, and the breaking strength (E) after the heat treatment step following the gold plating step satisfy a relation; (E)/(E)>0.70. |