| 发明名称 |
COATING/REPAIRING PROCESS USING ELECTROSPARK WITH PSP ROD |
| 摘要 |
An electrospark deposition electrode and an associated method for depositing coatings using the electrode are provided. The electrode includes a powder of a first metal and a powder of a second metal. The second metal is a braze alloy including nickel, the second metal having a lower melting point than the first metal. The powder of the first metal and the powder of the second metal are sintered together to form the electrode so that the powders are comingled but not combined within the electrode. The method includes depositing a layer of the first metal onto the substrate using an electrospark deposition process. |
| 申请公布号 |
US2016348249(A1) |
申请公布日期 |
2016.12.01 |
| 申请号 |
US201414552764 |
申请日期 |
2014.11.25 |
| 申请人 |
Lin Dechao;Bucci David Vincent;Kottilingam Srikanth Chandrudu;Cui Yan;Tollison Brian Lee;Schick David Edward |
发明人 |
Lin Dechao;Bucci David Vincent;Kottilingam Srikanth Chandrudu;Cui Yan;Tollison Brian Lee;Schick David Edward |
| 分类号 |
C23C26/02;F01D9/02;F01D5/00;F01D5/28;B23P6/04;B23P6/00 |
主分类号 |
C23C26/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for the deposition of a coating on a substrate including:
providing a substrate; providing an electrospark deposition electrode, wherein the electrospark deposition electrode includes a powder of a first metal, a powder of a second metal, wherein the second metal is a braze alloy including nickel, the powder of the second metal having a lower melting point than the first metal, wherein the powder of the first metal and the powder of the second metal are sintered together to form the electrospark deposition electrode so that the powder of the first metal and the powder of the second metal are comingled but not combined within the electrospark deposition electrode; and depositing a layer of the first metal onto the substrate using an electrospark deposition process. |
| 地址 |
Greer SC US |
