WAFER LEVEL FAN-OUT WITH ELECTROMAGNETIC SHIELDING

摘要

The present disclosure integrates electromagnetic shielding into a wafer level fan-out packaging process. First, a mold wafer having multiple modules is provided. Each module includes a die with an I/O port and is surrounded by an inter-module area. A redistribution structure that includes a shield connected element coupled to the I/O port of each module is formed over a bottom surface of the mold wafer. The shield connected element extends laterally from the I/O port into the inter-module area for each module. Next, the mold wafer is sub-diced at each inter-module area to create a cavity. A portion of the shield connected element is then exposed through the bottom of each cavity. A shielding structure is formed over a top surface of the mold wafer and exposed faces of each cavity. The shielding structure is in contact with the shield connected element.

主权项

1. A method comprising:
providing a mold wafer having a plurality of modules, wherein each of the plurality of modules comprises a die with an input/output (I/O) port at a bottom surface of the die, wherein the die is adjacent to an inter-module area and partially encapsulated by a mold compound leaving the bottom surface of the die exposed; forming a first dielectric pattern over a bottom surface of the mold wafer, wherein the I/O port is exposed through the first dielectric pattern for each of the plurality of modules; forming a redistribution structure over the first dielectric pattern, wherein the redistribution structure comprises a shield connected element that is coupled to the I/O port and extends laterally from the I/O port into the inter-module area for each of the plurality of modules; sub-dicing the mold wafer at the inter-module area to create a cavity for each of the plurality of modules, wherein the cavity extends into the mold wafer from a top surface of the mold wafer without extending completely through the mold compound; exposing a portion of the shield connected element through the bottom of the cavity for each of the plurality of modules; and forming a shielding structure over the top surface of the mold wafer and exposed faces of the cavity for each of the plurality of modules, wherein the shielding structure is in contact with the shield connected element.