CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING CHIP PACKAGE

摘要

The present disclosure relates to a chip package structure and a method for forming a chip package. A package unit is formed from the chip and an encapsulant surrounding the chip to have an increased area. A redistribution layer is formed on the package unit to draw out to and redistribute input/output terminals on a surface of the chip. The redistribution layer is then electrically coupled to a leadframe or a printed circuit board by external and electrical connectors. The method and the package structure are suitable for providing a chip package having input/output terminals with high density, reducing package cost, and improving package reliability.

主权项

1. A method for forming a chip package, comprising:
singulating a plurality of chips from a wafer, wherein each of said plurality of chips is provided with a plurality of pads of input/output terminals on an active surface; attaching said plurality of chips to a plate with active surfaces facing upward; filling spaces between adjacent ones of said plurality of chips with an encapsulant by a molding process, so that each of said plurality of chips and said encapsulant surrounding it form a package unit; forming an insulating layer having openings on said package unit, wherein each of said openings at least exposes a portion of each of said plurality of pads; forming a redistribution layer on said insulating layer which contacts exposed portion of each of said plurality of pads to redistribute said input/output terminals; and electrically coupling said redistribution layer to a leadframe or a printed circuit board by external and electrical connectors.