Semiconductor Structure Having Thermal Backside Core

摘要

A semiconductor structure includes a semiconductor substrate having a recess disposed beneath a semiconductor device. The semiconductor structure also includes a thermally conductive core disposed in the recess, and a package substrate including a heat sink. The heat sink is in thermal contact with the thermally conductive core.

主权项

1. A semiconductor structure, comprising:
a semiconductor substrate having a recess disposed beneath a semiconductor device; a thermally conductive core disposed in the recess; and a package substrate comprising a heat sink, wherein the heat sink is in thermal contact with the thermally conductive core.