| 摘要 |
Methods and apparatus for cavity formation in a semiconductor package substrate are provided. In one embodiment, a method for producing at least one cavity within a semiconductor package substrate includes etching the semiconductor package substrate from a surface of the semiconductor package substrate at least one intended cavity location in order to obtain at least one cavity. The method includes depositing a copper portion on a substrate in a cavity location. Next, the method includes masking the substrate while keeping the copper portion exposed. Lastly, the method includes etching the substrate to form a cavity by etching away the copper portion. The structure formed includes a cavity that extends partially through the substrate without damaging a glass fabric embedded in the substrate. |
