| 摘要 |
In a semiconductor device, a first to a sixth switching elements Tr1 to Tr6 are joined to a second main surface 2b of a substrate 2 with their electrode surfaces 10a facing the second main surface 2b of the substrate 2. Non-electrode surfaces 10b of the switching elements Tr1 to Tr6 are provided with respective heat spreaders 3 joined thereto. Each of the heat spreaders 3 is constituted of a heat spreader main body 31 and a pair of standing portions (gap determination portions) 32, 33. The heat spreader main body 31 is formed in a cuboid having rectangular flat surfaces that are elongated in one direction. The standing portions 32, 33 are standing on both edges of a surface (upper surface) of the heat spreader main body 31. |
