| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing system and a manufacturing method capable of increasing productivity of electronic component mounting substrate.SOLUTION: In the manufacturing system of an electronic component mounting substrate, a wiring formation material supply unit 2 forms a photocurable pattern 22 in an area including a terminal joint position P on a first plane of a transparent substrate 11. A mounting unit 3 mounts an electronic component to a mounting position on the first plane so that the external terminals 32 thereof land on the terminal joint position P. A light irradiation device 4 emits light from a second plane side of the substrate 11 to cure the photocurable pattern 22 with the light transmitting the substrate 11 to thereby form a conductive wiring pattern 21 and electrically joint the external terminals 32 to the conductive wiring pattern 21 at the terminal joint position P. A light quantity adjusting unit 7 differs a first irradiation light amount which is given to a terminal matching portion 23 corresponding to the terminal joint position P from a second irradiation light amount which is given to a terminal non-matching portion 24 not corresponding to the terminal joint position P. |
