发明名称 |
SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD FOR FORMING THE SAME |
摘要 |
A semiconductor package assembly is provided. The semiconductor package assembly includes a first semiconductor package. The first semiconductor package includes a first semiconductor die. A first redistribution layer (RDL) structure is coupled to the first semiconductor die and includes a first conductive trace. The semiconductor package assembly also includes a second semiconductor package bonded to the first semiconductor package. The second semiconductor package includes a second semiconductor die. An active surface of the second semiconductor die faces an active surface of the first semiconductor die. A second RDL structure is coupled to the second semiconductor die and includes a second conductive trace. The first conductive trace is in direct contact with the second conductive trace. |
申请公布号 |
EP3096350(A1) |
申请公布日期 |
2016.11.23 |
申请号 |
EP20160166762 |
申请日期 |
2016.04.24 |
申请人 |
MEDIATEK INC. |
发明人 |
LIN, TZU-HUNG;HSIAO, CHING-WEN;PENG, I-HSUAN |
分类号 |
H01L21/60;H01L23/31;H01L23/485;H01L23/538;H01L25/10 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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