发明名称 回路接続材料
摘要 The invention relates to a circuit connection material for connecting electrodes. The circuit connection material has excellent repairing performance and contains epoxy resin, cationic polymerization initiator and acrylic rubber containing (methyl) methyl acrylate copolymer. In this way, when the circuit connection material is pre-jointed on the terminal of a first electronic element has high mechanical strength, fracture of the circuit connection material due to position shift and peeling off of the circuit connection material can be prevented, and excellent repairing performance is thus obtained.
申请公布号 JP6027812(B2) 申请公布日期 2016.11.16
申请号 JP20120173730 申请日期 2012.08.06
申请人 デクセリアルズ株式会社 发明人 林 慎一
分类号 C09J163/00;C09J5/06;C09J11/06;C09J133/12;H05K3/32 主分类号 C09J163/00
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