THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, AND ELECTRIC/ELECTRONIC COMPONENT

摘要

A thermosetting resin composition containing a polyfunctional (meth)acrylate (a), a high-thermal-conductivity filler (b) having a thermal conductivity of 20 to 250 W/m·K, a curing agent (c), and a copolymer (d) having an acid group containing phosphoric acid, wherein the amount of the high-thermal-conductivity filler (b) is from 1600 to 2100 parts by mass per 100 parts by mass of the polyfunctional (meth)acrylate (a), and the amount of the copolymer (d) having an acid group containing phosphoric acid is from 7.5 to 30 parts by mass per 100 parts by mass of the polyfunctional (meth)acrylate (a).

主权项

1. A thermosetting resin composition comprising a polyfunctional (meth)acrylate (a), a high-thermal conductivity filler (b) having a thermal conductivity of 20 to 250 W/m·K, a curing agent (c), and a copolymer (d) having an acid group containing phosphoric acid, wherein
the polyfunctional (meth)acrylate (a) is composed of a difunctional di(meth)acrylate represented by a formula (I) shown below:
CH2═CR2COO—(R1O)n—COCR2═CH2  (I) (wherein n represents an integer of 1 or greater, R1 represents an alkylene chain or polymethylene chain containing 1 to 14 carbon atoms, and R2 represents a hydrogen atom or a methyl group) and an epoxy (meth)acrylate, an amount of the high-thermal conductivity filler (b) is from 1,600 to 2,100 parts by mass per 100 parts by mass of the polyfunctional (meth)acrylate (a), and an amount of the copolymer (d) having an acid group containing phosphoric acid is from 7.5 to 30 parts by mass per 100 parts by mass of the polyfunctional (meth)acrylate (a).