主权项 |
1. A high heat-dissipation chip package structure, comprising a base, a semiconductor chip, a connection plate, a pre-attachment film, and a potting compound, wherein:
the base has an upper surface and a lower surface opposite to each other, an adhesive layer is coated on the upper surface for adhering the semiconductor chip on the base; a bottom part of the semiconductor chip is adhered on the upper surface of the base via the adhesive layer and a top part of the sere chip is connected with the connection plate via another one adhesive layer; the connection plate is electrically connected with the semiconductor chip and a lead frame; the pre-attachment film is adhered on the connection plate; and a semiconductor chip set is finished fabricating and packaged by he potting compound. |