发明名称 Method of Manufacturing Semiconductor Devices and Semiconductor Device Containing Oxygen-Related Thermal Donors
摘要 A method of manufacturing a semiconductor device includes determining information that indicates an extrinsic dopant concentration and an intrinsic oxygen concentration in a semiconductor wafer. On the basis of information about the extrinsic dopant concentration and the intrinsic oxygen concentration as well as information about a generation rate or a dissociation rate of oxygen-related thermal donors in the semiconductor wafer, a process temperature gradient is determined for generating or dissociating oxygen-related thermal donors to compensate for a difference between a target dopant concentration and the extrinsic dopant concentration.
申请公布号 US2016329401(A1) 申请公布日期 2016.11.10
申请号 US201615146459 申请日期 2016.05.04
申请人 Infineon Technologies AG 发明人 Laven Johannes Georg;Jelinek Moriz;Schulze Hans-Joachim;Schustereder Werner;Stadtmueller Michael
分类号 H01L29/06;H01L21/8234;H01L29/739;H01L21/324 主分类号 H01L29/06
代理机构 代理人
主权项 1. A method of manufacturing a semiconductor device, the method comprising determining information indicating an extrinsic dopant concentration and an intrinsic oxygen concentration in a semiconductor wafer; determining, on the basis of information about the extrinsic dopant concentration and the intrinsic oxygen concentration as well as a generation rate or a dissociation rate of oxygen-related thermal donors in the semiconductor wafer, a process temperature gradient for generating or dissociating oxygen-related thermal donors to compensate for a difference between a target donor concentration and the extrinsic dopant concentration, wherein the target donor concentration is greater than an extrinsic donor concentration; and subjecting the semiconductor wafer to a main heat treatment that applies the process temperature gradient.
地址 Neubiberg DE