发明名称 |
Method of Manufacturing Semiconductor Devices and Semiconductor Device Containing Oxygen-Related Thermal Donors |
摘要 |
A method of manufacturing a semiconductor device includes determining information that indicates an extrinsic dopant concentration and an intrinsic oxygen concentration in a semiconductor wafer. On the basis of information about the extrinsic dopant concentration and the intrinsic oxygen concentration as well as information about a generation rate or a dissociation rate of oxygen-related thermal donors in the semiconductor wafer, a process temperature gradient is determined for generating or dissociating oxygen-related thermal donors to compensate for a difference between a target dopant concentration and the extrinsic dopant concentration. |
申请公布号 |
US2016329401(A1) |
申请公布日期 |
2016.11.10 |
申请号 |
US201615146459 |
申请日期 |
2016.05.04 |
申请人 |
Infineon Technologies AG |
发明人 |
Laven Johannes Georg;Jelinek Moriz;Schulze Hans-Joachim;Schustereder Werner;Stadtmueller Michael |
分类号 |
H01L29/06;H01L21/8234;H01L29/739;H01L21/324 |
主分类号 |
H01L29/06 |
代理机构 |
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代理人 |
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主权项 |
1. A method of manufacturing a semiconductor device, the method comprising
determining information indicating an extrinsic dopant concentration and an intrinsic oxygen concentration in a semiconductor wafer; determining, on the basis of information about the extrinsic dopant concentration and the intrinsic oxygen concentration as well as a generation rate or a dissociation rate of oxygen-related thermal donors in the semiconductor wafer, a process temperature gradient for generating or dissociating oxygen-related thermal donors to compensate for a difference between a target donor concentration and the extrinsic dopant concentration, wherein the target donor concentration is greater than an extrinsic donor concentration; and subjecting the semiconductor wafer to a main heat treatment that applies the process temperature gradient. |
地址 |
Neubiberg DE |