FAN-OUT PACKAGE STRUCTURE INCLUDING AN ANTENNA OR A CONDUCTIVE SHIELDING LAYER

摘要

A semiconductor package structure including a first semiconductor package is provided. The first semiconductor package includes a first semiconductor package including a first redistribution layer (RDL) structure (106) having a first surface (101) and a second surface (103) opposite thereto. A first semiconductor die (110a) and a first molding compound (120) that surrounds the first semiconductor die are disposed on the first surface of the first RDL structure. An IMD structure (134) having a conductive layer with an antenna pattern (132) is disposed on the first molding compound and the first semiconductor die.