| 发明名称 |
SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES, POWER MODULE, METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULES, PASTE FOR COPPER PLATE BONDING, AND METHOD FOR PRODUCING BONDED BODY |
| 摘要 |
A power module substrate according to the present invention is a power module substrate in which a copper sheet made of copper or a copper alloy is laminated and bonded onto a surface of a ceramic substrate (11), an oxide layer (31) is formed on the surface of the ceramic substrate (11) between the copper sheet and the ceramic substrate (11), and the thickness of aAg-Cu eutectic structure layer (32) is set to 15 µm or less. |
| 申请公布号 |
EP2930744(A4) |
申请公布日期 |
2016.11.02 |
| 申请号 |
EP20130860184 |
申请日期 |
2013.12.04 |
| 申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
TERASAKI NOBUYUKI;NAGATOMO YOSHIYUKI;NISHIKAWA KIMIHITO |
| 分类号 |
H01L23/12;C04B35/645;C04B37/02;H01L23/13;H01L23/36;H01L23/373;H01L23/42;H01L25/04;H01L25/18;H05K1/02 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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