VACUUM MOLD HAVING A REVERSE SOLID PATTERN, AND VACUUM-FORMING METHOD USING SAME

摘要

Provided is a vacuum mold having a reverse solid pattern, which enables an insert sheet to be vacuum-formed, and a solid pattern to be transferred to the insert sheet. The vacuum mold having the reverse solid pattern includes: a lower mold; and a solid pattern disposed on the surface of the lower mold. The insert sheet disposed above the lower mold is adsorbed to the surface of the lower mold by vacuum pressure in order to transfer a pattern of the solid pattern to the insert sheet.