| 摘要 |
An electronic equipment unit includes a multi-layer circuit board. A part arrangement region on which circuit parts are mounted and a terminal region are provided on the multi-layer circuit board. The part arrangement region is encapsulated with resin. An outline region is formed from a solder resist film surrounding the part arrangement region to prevent the resin from flowing into the terminal region. A non-solder resist region is provided so as to surround the outline region and formation of the solder resist film is inhibited in the non-solder resist region. A clamp abutting surface which is pressed by a mold and surrounds the terminal region and thereby prevents the resin from flowing into the terminal region is a partial region of the multi-layer circuit board where a surface layer circuit pattern is absent. |
