| 摘要 |
PROBLEM TO BE SOLVED: To prevent workpieces from being poorly lift-off processed or from being damaged even when lift-off processing is applied to small workpieces such as chip-like workpieces.SOLUTION: A support substrate S2 laminated with individual chip-like workpieces W comprised of a sapphire substrate S1 and a material layer M is mounted on a work stage 4. Laser light from a laser source 1 passes through a mask 21 and is irradiated onto the individual workpieces by a projection lens 2. The sapphire substrate S1 flying out from the chip-like workpieces during lift-off is saved from an optical path by saving means 7. The saving means 7 forms an airflow F on the optical path between the projection lens 2 and the work stage 4 and in a direction crossing the optical path. The sapphire substrate S1 is swept away by the airflow. |
