发明名称 |
SILVER PLATING MATERIAL AND METHOD FOR MANUFACTURING SAME |
摘要 |
A silver-plated product, wherein the preferred orientation plane of a surface layer of silver is {111} plane and wherein the ratio of the full-width at half maximum of an X-ray diffraction peak on {111} plane after heating the silver-plated product at 50 °C for 168 hours to the full-width at half maximum of an X-ray diffraction peak on {111} plane before the heating of the silver-plated product is not less than 0.5, is produced by forming the surface layer on a base material by electroplating at a liquid temperature of 12 to 24 °C and a current density of 3 to 8 A/dm 2 in a silver plating solution which contains 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium, so as to cause the product of the concentration of potassium cyanide and the current density to be 840 g €¢ A/L €¢ dm 2 or less. |
申请公布号 |
EP3078767(A1) |
申请公布日期 |
2016.10.12 |
申请号 |
EP20140859853 |
申请日期 |
2014.10.31 |
申请人 |
DOWA METALTECH CO., LTD |
发明人 |
SADAMORI, SHUNKI;MIYAZAWA, HIROSHI;OGATA, MASAFUMI;SHINOHARA, KEISUKE |
分类号 |
C25D7/00;C25D3/46;H01B1/02;H01B5/02;H01R13/03 |
主分类号 |
C25D7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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