发明名称 ETCHANT COMPOSITION AND ETCHING METHOD
摘要 PROBLEM TO BE SOLVED: To provide: an etchant composition for selectively etching an indium oxide-based layer from a laminate arranged by laminating, on a base, the indium oxide-based layer, and at least one layer of a copper layer and a copper alloy layer, which is less in corrosion in the copper layer and the copper alloy layer in comparison to a conventional etchant composition even with copper dissolved in the etchant composition; and an etching method with such an etchant composition.SOLUTION: An etchant composition consists of an aqueous solution comprising: hydrogen chloride or sulfuric acid; at least one compound selected from a group consisting of a chloride ion supply source, a fluoride ion supply source and a bromide ion supply source; and at least one compound selected from a group consisting of a compound having a thiol group and a hydroxyl group, and 1,10-phenanthroline, benzotriazole, phosphorous acid, a phosphite, hypophosphorous acid and a hypophosphite.SELECTED DRAWING: Figure 1
申请公布号 JP2016178103(A) 申请公布日期 2016.10.06
申请号 JP20150054728 申请日期 2015.03.18
申请人 ADEKA CORP 发明人 SAIBI YOSHIHIDE
分类号 H01L21/308;H01L21/306 主分类号 H01L21/308
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