| 摘要 |
A printed board (10) includes: a base material (12) having two main surfaces; at least one heat dissipating conductor layer (20) formed on at least one main surface of the two main surfaces of the base material (12); and a solder resist layer (22) formed on the surface of the heat dissipating conductor layer (20). In the printed board (10), the heat dissipating conductor layer (20) has the two main surfaces and at least one side surface, in the heat dissipating conductor layer (20), at least one main surface of the two main surfaces is in surface contact with a main surface of the base material (12), furthermore, the solder resist layer (22) has etching liquid resistance, and is formed on the other main surface of the two main surfaces of the heat dissipating conductor layer (20), the side surface of the heat dissipating conductor layer (20) is exposed, and the heat dissipating conductor layer (20) and the solder resist layer (22) form a laminated body (24) in a substantially protruding shape having a suitable height. Consequently, the printed board wherein heat dissipation effects are promoted as the whole printed board is obtained. |
