发明名称 |
ROUGHENED COPPER FOIL, COPPER FOIL PROVIDED WITH CARRIER, COPPER-CLAD LAMINATED SHEET, AND PRINTED WIRING BOARD |
摘要 |
Provided is a roughened copper foil which, when used in the SAP method, can endow a laminate with a surface profile excellent not only in plated circuit adhesion but also in etching performance for electroless copper plating and dry film resolution. This roughened copper foil has a roughened surface on at least one side, wherein: the roughened surface is provided with a plurality of substantially spherical projections composed of copper particles; the mean height of the substantially spherical projections is 2.60 μm or less; and the ratio bave/aave of the mean maximum diameter bave of the substantially spherical projections to the mean neck diameter aave of the substantially spherical projections is 1.2 or higher. |
申请公布号 |
WO2016158775(A1) |
申请公布日期 |
2016.10.06 |
申请号 |
WO2016JP59671 |
申请日期 |
2016.03.25 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
IIDA Hiroto;MATSUDA Mitsuyoshi;YOSHIKAWA Kazuhiro;KAWAI Nobuyuki;KATO Tsubasa |
分类号 |
C25D7/06;B32B15/20;C25D5/16;H05K3/18;H05K3/38 |
主分类号 |
C25D7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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