Methods and Devices for Fabricating and Assembling Printable Semiconductor Elements

摘要

The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

主权项

1. A wafer of printable light emitting diodes, the wafer comprising:
a substrate native to a plurality of printable light emitting diodes; and the plurality of printable light emitting diodes, each light emitting diode of the plurality of printable light emitting diodes disposed on the native substrate and partially released from the substrate such that each light emitting diode is connected to the substrate via a partially etched sacrificial layer, wherein a remaining portion of the partially etched sacrificial layer connecting each light emitting diode to the substrate breaks when a transfer device in contact with the plurality of printable semiconductor elements moves away from the substrate.