BONDING STATE DETECTION METHOD

摘要

A bonding state detection method is provided for detecting a bonding state of two substrates. Firstly, a first adhesive element, a second adhesive element, a first substrate and a second substrate are provided. The first adhesive element includes a sensing layer with a first sensing unit and a second sensing unit. After the first substrate and the second substrate are bonded together through the first adhesive element and the second adhesive element, a first resistance value of the first sensing unit and a second resistance value of the second sensing unit are detected. Then, according to the result of comparing the first resistance value with the second resistance value, the bonding state of the first adhesive element and the second adhesive element is judged. Consequently, the bonding state of the first substrate and the second substrate is realized.

主权项

1. A bonding state detection method, comprising steps of:
providing a first adhesive element, a second adhesive element, a first substrate and a second substrate, wherein the first adhesive element comprises a first conductive particle layer and a sensing layer, the sensing layer comprises a first sensing unit and a second sensing unit, and the second adhesive element comprises a second conductive particle layer; allowing the first substrate and the second substrate to be bonded together through the first adhesive element and the second adhesive element, wherein the first adhesive element and the second adhesive element are arranged between the first substrate and the second substrate, the first conductive particle layer is adhesively fixed on the sensing layer, and the second conductive particle layer is adhesively fixed over the first conductive particle layer; detecting a first resistance value of the first sensing unit and a second resistance value of the second sensing unit; and comparing the first resistance value with the second resistance value, wherein if the first resistance value and the second resistance value are different, judging that the first adhesive element and the second adhesive element are not completely adhered by each other.