| 发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME |
| 摘要 |
Disclosed is a printed circuit board. The printed circuit board includes an insulating layer, a copper foil formed on the insulating layer and formed therein with a groove to expose a portion of a top surface of the insulating layer, and a thermal conductive layer filled in the groove. |
| 申请公布号 |
US2016295684(A1) |
申请公布日期 |
2016.10.06 |
| 申请号 |
US201615184511 |
申请日期 |
2016.06.16 |
| 申请人 |
LG INNOTEK CO., LTD. |
发明人 |
Cho Yong Seok;Kim Chang Sung |
| 分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board comprising:
an insulating layer; a circuit pattern disposed on the insulating layer and formed therein with a first opening section to expose a portion of a top surface of the insulating layer; and a thermal conductive layer filled in the first opening section. |
| 地址 |
Seoul KR |
