发明名称 基板処理装置および基板処理方法
摘要 Transport mechanisms are respectively provided in first and second processing blocks. Each transport mechanism has a hand. The hand holds the other surface of a substrate without coming into contact with an edge of the substrate. The hand is moved such that the substrate is transported between an adhesion reinforcement processing unit or a cooling unit and a coating processing unit or a development processing unit. In the adhesion reinforcement processing unit and the cooling unit, temperature processing is performed on the substrate while the back surface of the substrate is held by suction. In the coating processing unit and the development processing unit, a processing liquid is supplied to the main surface of the substrate while the back surface of the substrate is held by suction by a spin chuck.
申请公布号 JP6001961(B2) 申请公布日期 2016.10.05
申请号 JP20120188492 申请日期 2012.08.29
申请人 株式会社SCREENセミコンダクターソリューションズ 发明人 柏山 真人;西山 耕二
分类号 H01L21/677;H01L21/027;H01L21/304 主分类号 H01L21/677
代理机构 代理人
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