| 摘要 |
PROBLEM TO BE SOLVED: To allow for breaking a semiconductor wafer.SOLUTION: When breaking a semiconductor wafer 10, scribe lines are formed previously in a reticular pattern. A flat breaking jig 20 is used for breaking the semiconductor wafer. The breaking jig 20 has reticular grooves 23, 24 of the same pitch as that of the scribe lines of the semiconductor wafer 10. Breaking is performed by pressing a break bar 33 along the scribe lines. Consequently, the semiconductor wafer can be broken into a large number of chips. |
