发明名称 |
BUMP FORMING METHOD, BUMP FORMING APPARATUS, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
A bump forming method includes: a bonding step of bonding the leading end of a wire extending out of the tip of a bonding tool to a first point (X1); a wire pay-out step of moving the bonding tool in a direction away from the first point; a thin portion forming step of pressing a portion of the wire at a second point (X2) on a reference plane using the bonding tool to form a thin portion (64) in the wire; a wire shaping step of shaping the wire bonded to the first point in a manner rising from the reference plane; and a bump forming step of cutting the wire at the thin portion to form a bump (60) having a shape rising from the reference plane at the first point. It is therefore possible to form a bump having a desired height more easily and efficiently. |
申请公布号 |
SG11201606917T(A) |
申请公布日期 |
2016.09.29 |
申请号 |
SGT11201606917 |
申请日期 |
2014.04.24 |
申请人 |
SHINKAWA LTD. |
发明人 |
YOSHINO HIROAKI;TOYAMA TOSHIHIKO |
分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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