| 摘要 |
The present invention provides a stacked wiring film for electronic components with a new coating layer, to use low resistance Ag or Cu as a conductive layer, and capable of ensuring adhesive, weatherproof and anti-oxidation properties, and stably performing highly precise wet etching, and a sputtering target material for forming a coating layer. According to the present invention, the stacked wiring film comprises: a conductive layer formed by one kind selected among Ag, Ag alloy, Cu and Cu alloy; and a coating layer to cover at least one surface of the corresponding conductive layer. The coating layer can be formed by a stacked wiring film comprising Mo of 5 to 50 atom%, the corresponding Mo and Cu of 60 atom% or less as a sum, and the remainder including Ni and unavoidable impurities, and by a sputtering target material for forming a coating layer, comprising Mo of 5 to 50 atom%, the corresponding Mo and Cu of 60 atom% or less as a sum, and the remainder including Ni and unavoidable impurities, and having a Curie point of room temperature or less. |
