| 发明名称 |
Method for producing a hole |
| 摘要 |
A process for producing a hole (7) in a component (1) comprises using a pulsed energy beam (22), especially a laser. During material removal, different pulse lengths are used at the start to the finish. When the short pulses are used, the beam is moved over the whole surface. |
| 申请公布号 |
EP2295195(B1) |
申请公布日期 |
2016.09.28 |
| 申请号 |
EP20100014897 |
申请日期 |
2005.12.21 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
BECK, THOMAS;SETTEGAST, SILKE;WOLKERS, LUTZ DR. |
| 分类号 |
B23K26/38;F01D5/18 |
主分类号 |
B23K26/38 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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