| 摘要 |
The present invention provides a method to manufacture a stacked device, capable of easily removing a support wafer from a wafer. According to the present invention, a support wafer (3) temporarily bonded on a surface (1a) of a first device wafer (1) by a temporary adhesive material (4) is made of a silicon wafer. When the temporary adhesive material (4) is exposed by performing a temporary adhesive material exposure process after a bonded wafer formation process, the support wafer (3) is removed by at least polishing without heating the temporary adhesive material (4), so it is easily removed from the first device wafer (1), and thereby dislocation between the stacked first and second device wafer (1, 2) is not generated. A temporary adhesive material removing process is performed after the temporary adhesive exposure process, so the temporary adhesive material (4) is removed from a device (D) of the first device wafer (1), and thereby removal of the temporary adhesive material (4) and cleaning of the device (D) can be performed at the same time. |
