| 摘要 |
A carrier 102 bears at least one insert 104, the insert being retained by compression exerted by the carrier. The carrier may be a ceramic substrate bearing a diamond, sapphire or carbide insert, the insert being compressively retained by the ceramic substrate shrinking around the insert. The ceramic may comprise an oxide, a nitride, a silicate or feldspars. The carrier may be arranged to receive the insert when in a first state and to compressively retain the insert when in a second state. The substrate may shrink irreversibly on heating, firing or curing. For example, a ceramic substrate is fired to form a shrink fit around a diamond insert, thereby applying a compression force to retain the insert. The carrier may be used to connect a heat generating component such as a transistor, an integrated circuit, a switch, an optical element or an RF element to a heat sink. The optical element may be an optical modulator and the inserts may provide an optical and/or thermal path from the modulator. |
