| 摘要 |
PROBLEM TO BE SOLVED: To improve manufacturing efficiency while accurately positioning a scintillator array and a photodiode array.SOLUTION: A scintillator array 13 is bonded (finally fixed) to a photodiode array 12 through a main adhesive 14. Namely, between the scintillator array 13 and the photodiode array 12, the main adhesive 14 is uniformly interposed. As the main adhesive 14, for example, an epoxy resin-based adhesive is used. The scintillator array 13 is temporarily fixed to the photodiode array 12 by an auxiliary adhesive 15 having hardening time shorter than that of the main adhesive 14. As the auxiliary adhesive 15, for example, ultraviolet ray curable adhesive is used. |
