| 摘要 |
PROBLEM TO BE SOLVED: To enhance workability while maintaining heat dissipation performance of a heating component.SOLUTION: The body 4 of IGBT2 is located on the opposite side of a circuit board 8 while holding the side edge 9 thereof therebetween. A plurality of leads 10 projecting from the body 4 toward the circuit board 8 are extended above one surface 12 of the circuit board 8 over the side edge 9, and soldered to a predetermined position of the circuit board 8. A first strip body 18 obtained by impregnating a flame-retardant fiber body, having liquid impregnation properties, with an insulating liquid is provided above the exposed part of each lead 10 so as to cover the exposed part, on one surface 12 side of the circuit board. |
