DRYING APPARATUS FOR SEMICONDUCTOR WAFER

摘要

According to the present invention, provided is an apparatus for drying a semiconductor wafer. The apparatus for drying a semiconductor wafer includes: a chamber; a stage rotating a wafer inside the chamber; an air injection unit facing the upper surface of the wafer inside the chamber to discharge air downwards; and a side exhaustion line installed in a side wall of the chamber to exhaust the air. The air injection unit forms an air flow of a laminar flow toward the wafer.