| 摘要 |
The objective of the present invention is to provide a structurally stable through-electrode substrate in which defects that accompany the presence of a boundary in an insulating portion disposed in the vicinity of the peripheral edge of a through-electrode are eliminated, and a method for manufacturing said substrate. The through-electrode substrate is characterized in having a base that has a first surface and a second surface that are mutually opposed, and a through-electrode disposed in a through-hole that passes from the first surface to the second surface of the base, the through-electrode having a first-surface-side end face and a second-surface-side end face that are exposed from the base on the first surface and the second surface, the peripheral edge of the first-surface-side end face and/or second-surface-side end face being covered by the base. |
