发明名称 ALKALINE DRY CELL
摘要 An alkaline dry cell of the present invention includes: a positive electrode case having a nickel plating layer on its surface; a positive electrode provided in the positive electrode case; and a negative electrode provided in a hollow portion of the positive electrode with a separator interposed between the positive and negative electrodes. The positive electrode case has a nickel-cobalt alloy plating layer and a carbon material layer which extend over the nickel plating layer on an inner surface of the positive electrode case, and the carbon material layer is formed after annealing of the alloy plating layer. The alloy plating layer has a thickness ranging from 0.05 μm to 0.4 μm, and a mass ratio of cobalt relative to a total amount of nickel and cobalt contained in the alloy plating layer ranges from 37% to 57%.
申请公布号 US2016268588(A1) 申请公布日期 2016.09.15
申请号 US201415034152 申请日期 2014.09.17
申请人 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. 发明人 OKADA Tadaya
分类号 H01M4/06;H01M4/10;H01M2/30;H01M4/62;H01M4/42;H01M2/16;H01M6/08;H01M4/50 主分类号 H01M4/06
代理机构 代理人
主权项 1. An alkaline dry cell comprising: a positive electrode case made of a nickel-plated steel plate having a nickel plating layer on a surface thereof; a positive electrode having a hollow cylindrical shape and provided in the positive electrode case; and a negative electrode provided in a hollow portion of the positive electrode with a separator interposed between the positive and negative electrodes, wherein the positive electrode case has a nickel-cobalt alloy plating layer and a carbon material layer which extend over the nickel plating layer on an inner surface of the positive electrode case, the carbon material layer is formed after annealing of the nickel-cobalt alloy plating layer formed on the nickel plating layer, the nickel-cobalt alloy plating layer has a thickness ranging from 0.05 μm to 0.4 μm, and a mass ratio of cobalt relative to a total amount of nickel and cobalt contained in the nickel-cobalt alloy plating layer ranges from 37% to 57%.
地址 Osaka-shi, Osaka JP