发明名称 |
THERMOSETTING RESIN COMPOSITION AND USES THEREOF |
摘要 |
The present invention relates to a thermosetting resin composition. The composition comprises from about 20 wt. % to about 70 wt. % of a thermosetting resin, from about 1 wt. % to about 30 wt. % of a curing agent, from about 0 wt. % to about 10 wt. % of an accelerant, a tungsten compound, and an inorganic filler. A prepreg may be prepared in an impregnation manner or a coating product may be prepared in a coating manner. The composition may decrease the thermal expansion coefficient of laminates and may effectively block UV light and decrease the light transmissivity. |
申请公布号 |
US2016264745(A1) |
申请公布日期 |
2016.09.15 |
申请号 |
US201315033299 |
申请日期 |
2013.11.06 |
申请人 |
SHENGYI TECHNOLOGY CO., LTD. |
发明人 |
Du Cuiming;Chai Songgang |
分类号 |
C08J5/24;C08K3/22;C08K3/36;C08K3/30;C08K5/56 |
主分类号 |
C08J5/24 |
代理机构 |
|
代理人 |
|
主权项 |
1. A thermosetting resin composition, wherein the thermosetting resin composition comprises a thermosetting resin, an inorganic filler and a tungsten compound. |
地址 |
Dongguan, Guangdong CN |