| 摘要 |
Disclosed is a lead-free, low melting point glass composition, which is characterized by being substantially free from a lead component and comprising 0-8 mass % of SiO 2 , 2-12 mass % of B 2 O 3 , 2-7 mass % of ZnO, 0.5-3 mass % of RO (MgO + CaO + SrO + BaO), 0.5-5 mass % of CuO, 80-90 mass % of Bi 2 O 3 , 0.1-3 mass % of Fe 2 O 3 , and 0.1-3 mass % of Al 2 O 3 . This glass composition is not easily crystallized at high temperatures and is stable. Therefore, it is useful as an insulating coating material and a sealing material for electronic material substrates. |
