| 摘要 |
A device of contacting a substrate with a probe card includes a mounting table 15 that transfers a wafer W together with a wafer plate 24 to a position facing the probe card 19; a lifting device 15a that contacts multiple electrodes of semiconductor devices formed on the wafer W with multiple probes of the probe card 19 by moving the wafer plate 24 and the wafer W toward the probe card 19 and then further moves the wafer W toward the probe card 19; a depressurization path 26 that decompresses a space S between the probe card 19 and the wafer plate 24 and maintains a contact state between the electrodes of the semiconductor devices and probes 19b of the probe card 19; and the lifting device 15a that separates a chuck member 14 on the mounting table 15 from the wafer plate 24. |
